CEMS offer single and multichip hybrid modules for the high reliability markets such as Aerospace & Defence, Space, Oil & Gas, Medical and High End Industrial to name but a few.
With over 30 years experience, we provide full electronic, mechanical and test design, sourcing and production capabilities for these thick film hybrids, in effect solving our customers’ problems whether it be miniaturisation, ruggedisation, improved reliability or obsolescence management.
We’ve designed and manufactured products including, power, high pin count FPGAs/processors, analog, digital and mixed signal. We’re also developing IP for smart sensors, which allow for sensor data to be sent directly onto a range of bus architectures. We offer in house board printing, component die placement, wire bonding final mechanical assembly, programming and test (electrical and environmental), i.e. full end to end production and test of a module.
To discuss your requirements please contact one of our sales team on: email@example.com.